[OpenTRV-interest] Thinking aloud re what to integrate on the MCU board
dhd at exnet.com
Thu Apr 30 13:45:31 BST 2015
Our IoT Launchpad pitch shows the power, radio and microcontroller (and sensor) boards as separate and stackable, and they certainly should be available in that form.
But there also advantages (eg space and cost) to integrating common combinations onto merged boards (ie that cover 2 or 3 levels of the stack) such as we have with OpenTRV.
It strikes me that having the radio module and its support code integrated makes particular sense where possible, eg because the crypto support code may be very different for different radios and so only having the right set taking Flash space could be helpful.
Equally, hosting a TMP112 temperature sensor by default and some simple power conditioning seems sensible.
Anyone have any thoughts on what merged board elements might be be useful optimisations alongside the simple separated function boards?
Also, what depth vertically should we allow for by default for the stacked boards, esp sensors? Enough to take a socketed DIL plastic chip or more or less?
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